Electronic component and method for manufacturing the same

ABSTRACT

An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

This application is a Continuation of application Ser. No. 09/856,822,filed Aug. 27, 2001, now issued as U.S. Pat. No. 6,804,103 which is aNational Phase Application of PCT International ApplicationPCT/JP00/06646.

TECHNICAL FIELD

The present invention relates to a SAW (Surface Acoustic Wave) device orthe like electronic component that houses electronic device chip in thepackage. The present invention relates also to a method formanufacturing the electronic components.

BACKGROUND ART

FIG. 5 shows a plan view of a conventional SAW device, while FIG. 6shows the cross sectional view. As shown in these drawings, aconventional SAW device is manufactured by first stacking a firstceramic frame body 101 on one of the surfaces of a ceramic substrate100, and a second ceramic frame body 102 on the first ceramic frame body101, and these frame bodies together with the substrate are fired toform an integrated package 103. An internal contact electrode 104 and ashield electrode 105 are formed on certain predetermined areas of thepackage 103, and a seam ring 110 is provided on the upper-end surface ofthe package by means of silver brazing. And then, the internal contactelectrode 104, the shield electrode 105 and the seam ring 110 are goldplated on the surface.

A SAW chip 107 is comprised of comb-formed electrodes for input/outputformed on a piezoelectric substrate (not shown), and reflectorelectrodes and contact electrodes coupled with the comb-formedelectrodes provided at both sides of the comb-formed electrode. The SAWchip 107 is mounted on the bottom surface of a cavity of the package103; namely, it is mounted on the shield electrode 105 provided on thesurface of ceramic substrate 100, with an adhesion layer 106 interposedin between. Next, a pattern recognition is conducted from above thepackage 103, namely from the seam ring 110 side towards the SAW chip107, for detecting boundaries between the second ceramic frame body 102and the first ceramic frame body 101, and between the internal contactelectrode 104 and a non-internal contact electrode portion 108 a,108 b.

A location for bonding a wire 109 on the internal contact electrode 104is determined based on the two boundaries detected through the aboveprocedure as well as the dimensional particulars of the package 103.

In accordance with the location determined as above, the SAW chip 107and the internal contact electrode 104 are interconnected by the wire109, and then a lid 111 is welded on the seam ring 110 of package 103.

In the above-described conventional technology, however, it is extremelydifficult to establish the location at a high accuracy level, because ofa displacement which occurs when silver-brazing the seam ring 110.

If a location thus determined is not accurate enough, the wire 109, forexample, could be connected erroneously with the shield electrode 105,or an defective connection between the wire 109 and the internal contactelectrode 104 might arise.

The present invention aims to offer an electronic component, in which anelectronic device chip can be aligned to a certain specific location ata high accuracy level and an accurate location is established at a highaccuracy level for bonding a wire on the internal contact electrode. Amethod for manufacturing the electronic components is also offered bythe present invention.

DISCLOSURE OF THE INVENTION

The outline structure of an electronic component of the presentinvention is that it is provided with a pattern suitable for aligning aSAW device chip or the like electronic device chip and aninterconnection wire accurately to certain specified places of a packageof the electronic component.

The outline of a method for manufacturing the electronic components ofthe present invention is that the package is provided with a steppedlevel-difference on the inner wall of cavity, and aligning of at leasteither said device chip or interconnection wire to a certain specifiedlocation is effected after detecting the boundary formed by the steppedlevel-difference and the inner bottom surface of said package at a highaccuracy level.

Practically described, an electronic component of the present inventioncomprises a package, which having a cavity formed within and the cavityis provided with a stepped level-difference on the inner wall surface;an internal contact electrode provided on the upper end-surface of saidstepped level-difference of the inner wall; a shield electrode providedon the inner bottom surface of said package; a device chip disposed onthe shield electrode; and an interconnection wire for connecting thedevice chip with said internal contact electrode. Said inner bottomsurface is provided with a non-electrode portion, which region is usedfor aligning at least either said device chip or said interconnectionwire to a certain specific location. Said non-electrode portion can beused as a recognition pattern for aligning at least either the devicechip or the interconnection wire to a certain specific location in thepackage. Since the non-electrode portion is different in color from theshield electrode formed on the inner bottom surface of the package, aplace for mounting the device chip and a spot for bonding theinterconnection wire on the internal contact electrode can be determinedaccurately by making use of the non-electrode portion.

Another electronic component of the present invention comprises aceramic substrate; a first ceramic frame body formed on one of thesurfaces of said ceramic substrate; a second ceramic frame body formedon said first ceramic frame body; stepped level-differences formedbetween said ceramic substrate and said first ceramic frame body andbetween said first ceramic frame body and said second ceramic framebody; an internal contact electrode formed on one of the surfaces ofsaid first ceramic frame body, which surface being in the same side as ajunction formed between said first ceramic frame body and said secondceramic frame body, which internal contact electrode extending over theside faces of said first ceramic frame body and said ceramic substrateas far as the other surface of said ceramic substrate; a shieldelectrode formed on the one surface of said ceramic substrate for havingsaid device chip thereon, and said device chip is mounted on said shieldelectrode; and an interconnection wire for connecting said device chipwith said internal contact electrode. The inner bottom surface of saidpackage is provided with a non-electrode portion, which region is usedfor aligning at least either said device chip or said interconnectionwire to a certain specific location. As already described above, thenon-electrode portion may be considered as a recognition pattern foraligning at least either the device chip or the interconnection wire toa certain specific location. Thus a place for mounting the device chipand a spot for bonding the interconnection wire on the internal contactelectrode can be determined at a high accuracy level.

Other features of the electronic component of the present inventioninclude that it is provided with said non-electrode portion for at leasttwo, said device chip is disposed on said shield electrode at an areathat is specified by connecting said two non-electrode portions. Whenviewed from above the package, one of the sides of said non-electrodeportion is coincidental with one of the sides of said internal contactelectrode. Furthermore, one of the sides of said internal contactelectrode, or the extension, is crossing substantially at a right anglewith one of the sides of said non-electrode portion, or the extension.The clearance formed between the opposing inner walls of a package isgreater at the lower stepped level-difference than at the upper steppedlevel-difference. In the electronic component of the present invention,a place for mounting the device chip and a spot for bonding theinterconnection wire on the internal contact electrode can be determinedat a higher accuracy level by taking advantage of the above-describedfeatures. In the electronic component of the present invention, theupper surfaces of the internal contact electrode and the device chip aredisposed on substantially the same plane. With such configuration, bothof the internal contact electrode and the device chip are brought intothe focused zone together during the pattern recognition. Thiscontributes to determining the bonding location of the interconnectionwire on the internal contact electrode at a higher accuracy level.

Further, in the electronic component of the present invention, thelength, in the direction from the internal contact electrode to thedevice chip, of a side of the non-electrode portion is greater than thefocus displacement margin of a lens used for recognizing said boundaryformed by the internal contact electrode and the non-electrode portion.With the above configuration, boundary between the internal contactelectrode and the non-electrode portion can be recognized at a highprecision level. Furthermore, a side of the non-electrode portion facingthe internal contact electrode is longer than the gap between saidinternal contact electrodes. With the above configuration, boundarybetween the internal contact electrode and the shield electrode can berecognized at a high reliability level, even if there happens adisplacement with the non-electrode portion.

A method for manufacturing the electronic components in accordance withthe present invention comprises a first step for mounting a device chipin a package, which package having a cavity provided with steppedlevel-differences opposing to each other on the inner wall surface and aplurality of internal contact electrodes on the upper-end surface ofsaid stepped level-difference; a second step for detecting a boundaryformed by said stepped level-difference and the inner bottom surface ofsaid package, as viewed from the above, for at least two, anddetermining spots for coupling said internal contact electrode with saiddevice chip by means of the interconnection wire, based on results ofthe detection; a third step for electrically connecting said device chipwith said internal contact electrode using said interconnection wire;and a fourth step for sealing said package with a lid at the opening. Inaccordance with the above-described method of manufacture, the internalcontact electrode and the device chip can be connected reliably with theinterconnection wire.

Further, in a method for manufacturing the electronic components inaccordance with the present invention, the package of which having ashield electrode at the inner bottom surface and the inner bottomsurface of the package, when viewed from the above, is provided with anon-electrode portion in a zone facing said stepped level-difference, aspot for bonding the interconnection wire is determined after detecting,in the first step, a boundary formed by said non-electrode portion andsaid stepped level-difference for at least two. In accordance with thismethod of manufacture, spots for bonding the interconnection wire on theinternal contact electrode and the device chip can be determined moreaccurately.

A method for manufacturing the electronic components in accordance withthe present invention, the package of which having a cavity providedwith stepped level-differences opposing to each other on the inner wallsurface and a plurality of internal contact electrodes on the upper-endsurface of said stepped level-difference, comprises a first step fordetermining a place for mounting a device chip after detecting aboundary formed by said stepped level-difference and the inner bottomsurface, as viewed from the above, for at least two; a second step formounting said device chip in said package at the inner bottom; a thirdstep for electrically interconnecting said device chip and said internalcontact electrode with the interconnection wire; and a fourth step forsealing said package with a lid at the opening. In accordance with theabove-described method of manufacture, a device chip can be mounted in apackage at a high reliably level.

Furthermore, a method for manufacturing the electronic components inaccordance with the present invention, whose package having a shieldelectrode formed on the inner bottom surface and provided with anon-electrode portion on said inner bottom surface at the end facingsaid internal contact electrode, determines a place for mounting adevice chip, as viewed from the above in the first step, after detectinga cross point formed by one of the sides of said, or the extension, andone of the sides of said internal contact electrode, or the extension,for at least two. In accordance with the method, a device chip can bemounted in a package in a more reliable manner.

A method for manufacturing the electronic components in accordance withthe present invention, whose package having a cavity provided withopposing stepped level-differences on the inner wall surface andprovided internal contact electrode on the upper end-surface of saidstepped level-difference, comprises a first step for determining a placefor mounting the device chip in the package after detecting, as viewedfrom above the package, said boundary formed by the steppedlevel-difference and the inner bottom surface for at least two, a secondstep for mounting said device chip in said package, a third step fordetermining spots for interconnecting said internal contact electrodeand said device chip with the interconnection wire after detecting, asviewed from above the package, said boundary formed by the steppedlevel-difference and the inner bottom surface for at least two, a fourthstep for electrically interconnecting said device chip and said internalcontact electrode with the interconnection wire, and a fifth step forsealing said package at the opening with a lid. In accordance with theabove-described method of manufacture, a device chip can be mounted in apackage and the device chip and the internal contact electrode can beinterconnected with an interconnection wire at a higher reliabilitylevel.

Furthermore, in a method for manufacturing the electronic components inaccordance with the present invention, the package of which having ashield electrode on the inner bottom surface and provided with anon-electrode portion on the inner bottom surface at a side facing theinternal contact electrode, a place for mounting the device chip isdetermined after detecting, in the first step, a cross point formed byone of the sides of said non-electrode portion, or the extension, andone of the sides of said internal contact electrode, or the extension,for at least two, and spots for bonding the interconnection wire aredetermined, in the third step, after detecting a cross point formed byone of the sides of said non-electrode portion, or the extension, andone of the sides of said internal contact electrode, or the extension,for at least two. In accordance with the above-described method ofmanufacture, a device chip can be mounted in a package and the devicechip and the internal contact electrode can be interconnected with aninterconnection wire at a higher reliability level.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a SAW device, in accordance with exemplaryembodiments 1 through 3 of the present invention, before the package issealed with a lid.

FIG. 2 is a cross sectional view of the SAW device, in accordance withexemplary embodiments 1 through 3.

FIG. 3 is a plan view of a SAW device, in accordance with otherexemplary embodiments of the present invention.

FIG. 4 is a cross sectional view of the SAW device, in accordance withthe other exemplary embodiments.

FIG. 5 is a plan view of a conventional SAW device, before it is sealedwith a lid.

FIG. 6 is a cross sectional view of the conventional SAW device.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1

FIG. 1 shows a SAW device in accordance with a first exemplaryembodiment of the present invention, as viewed from the above, or thelid side, before it is sealed with a lid. FIG. 2 shows a cross sectionalview of the SAW device of FIG. 1, sectioned at the line A-B.

The first embodiment of the present invention is described in thefollowing with reference to the drawings. On one of the surfaces of aceramic substrate 10, namely the surface on which a SAW chip 17 ismounted, a first ceramic frame body 11 and a second ceramic frame body12 whose size being different from the first ceramic frame body 11, arestacked in the order to form a package 13, which package having a cavityprovided with a stepped level-difference 26.

An internal contact electrode 14 is formed covering one of the surfacesof the first ceramic frame body 11 (upper surface), the side faces ofthe ceramic substrate 10 and the first ceramic frame body 11, and partof the other surface (bottom surface) of the ceramic substrate 10.

A shield electrode 15 is formed on the upper surface of the ceramicsubstrate 10, on which the SAW chip 17 is mounted via an adhesion layer16. Non-electrode portion 18 a, 18 b are provided on the inner bottomsurface of package 13 at the sides facing the stepped level-difference26. The SAW chip 17 is disposed on said shield electrode at a certainarea that is specified by connecting said two non-electrode portion 18a, 18 b.

A first thing for manufacturing the electronic components of the presentinvention is to provide a plating under-layer on the upper surface, thebottom surface and the side face of ceramic substrate 10 in such areaswhere the shield electrode 15 and the internal contact electrode 14 areto be formed. Next, on the upper surface of the ceramic substrate 10, afirst ceramic frame body 11 is formed. The plating under-layer isprovided also on the upper surface and the side face of the firstceramic frame body 11 for an area of the same shape as the internalcontact electrode 14, which is to be formed later thereon.

And then, on the first ceramic frame body 11, a second ceramic framebody 12, which has the same dimensions in the outer circumference andnarrower in the body width relative to those of the first ceramic framebody 11, is provided to create the stepped level-difference 26 insidethe package 13. These are fired together to form an integrated package13 consisting of the ceramic substrate 10, and the first and the secondceramic frame bodies 12, 13. The plating under-layer is provided also onthe upper surface of the second ceramic frame body 12.

The ceramic substrate 10, the first ceramic frame body 11 and the secondceramic frame body 12 have been manufactured mainly of aluminum oxide,and the plating under-layer has been formed mainly of tungsten material.

The package 13 is plated with nickel over the plating under-layer, and aseam ring 20, thermal expansion coefficient of which being the same oridentical to that of the package 13, is formed by means of silverbrazing on the upper surface of the second ceramic frame body 12.

It undergoes nickel plating again, and then gold plating for forming theinternal contact electrode 14 and the shield electrode 15.

As FIG. 1 illustrates, the internal contact electrode 14 is provided oneach of the upper surface of the stepped level-differences 26 formed onthe inner wall of package 13 (the upper surface of the first ceramicframe body 11) for a plurality of pieces extending as far as edge of theinner circumference; respective sides of the internal contact electrodebeing in parallel with respective sides of the package 13 (sides of thefirst ceramic frame body 11). Consequently, the internal contactelectrode 14 assumes a substantially rectangular shape, or a squareshape.

Also, respective sides of the non-electrode portion 18 a, 18 b providedon the inner bottom surface of package 13 are in parallel withrespective sides of the package 13, and the region is reaching thebottom end of the first ceramic frame body 11 at the innercircumference. Namely, the region 18 a, 18 b assumes a substantiallyrectangular shape, or a square shape, with the internal contactelectrode 14 and the region 18 a, 18 b being disposed in an arrangementsubstantially rectangular to each other.

Non-electrode portion 18 a, 18 b is provided for two at both sides ofthe SAW chip 17 so that it is disposed immediately next to the internalcontact electrode 14, as viewed, in FIG. 2, from above the package 13,or from the seam ring 20 side towards the SAW chip 17.

A SAW chip 17 comprises comb-formed electrodes 22 for input/outputformed on the substrate and a plurality of contact electrodes 24, whichbeing coupled with the reflector electrode 23 and the comb-formedelectrode 22, provided at both sides of the comb-formed electrode 22.

The SAW chip 17 is mounted on the shield electrode 15 of the package 13,with an adhesion layer 16 interposed in between. Contact electrode 24 ofthe SAW chip 17 is substantially on the same level as the internalcontact electrode 14 in the height. As viewed from above the package 13,the non-electrode portion 18 a, 18 b is disposed between the internalcontact electrode 14 and the contact electrode 24 of SAW chip 17.

The package 13 undergoes a pattern recognition procedure from the above.A point of boundary formed by the non-electrode portion 18 a, 18 b andthe internal contact electrode 14 is detected at each of the opposingstepped level-differences 26, and the middle point is established on astraight line connecting the two points. Using the middle point asreference, and based on various dimensional particulars of the package13, a spot for bonding the interconnection wire 19 on the internalcontact electrode 14 is determined. Pattern of electrodes such as thecomb-formed electrode 22, contact electrode 24, etc. formed on thesurface of SAW chip 17, is also recognized, and, based on which, a spotfor bonding the interconnection wire 19 on the contact electrode 24 isdetermined. And then, the interconnection wire 19 is bonded at one endon the internal contact electrode 14, while the other end on the contactelectrode 24 of SAW chip 17, for electrical connection. A lid 21 iswelded on a seam ring 20 provided around the upper surface of package 13to have the SAW chip 17 sealed in the package 13.

Embodiment 2

Embodiment 2 relates to the procedure of determining a location formounting a SAW chip 17, and the description is made with reference toFIG. 2. In the same way as in embodiment 1, a package 13 having aninternal contact electrode 14 and a shield electrode 15, as well as aSAW chip 17, are prepared as the first step. The SAW chip 17 is mountedon the shield electrode 15 via an adhesion layer 16. A patternrecognition is conducted on the package 13 from the above to detect across point formed by the non-electrode portion 18 a, 18 b and theinternal contact electrode 14. The middle point is established in astraight line connecting the corresponding two cross points. Using themiddle point as reference, and based on various dimensional particularsof the package 13, a place for mounting a SAW chip 17 is determined.

In other words, the non-electrode portion 18 a, 18 b is provided for atleast two, and a SAW chip 17 is placed somewhere in a straight lineconnecting the two. And the SAW chip 17 is mounted at the location onthe shield electrode 15 of package 13 via an adhesion layer 16.

Next, after the contact electrode 24 of SAW chip 17 and the internalcontact electrode 14 are connected using an interconnection wire 19, alid 21 is welded on a seam ring 20 provided around the upper surface ofpackage 13 to have the SAW chip 17 sealed in the package 13.

Embodiment 3

Embodiment 3 relates to the procedure of determining a place for bondingan interconnection wire 19 on an internal contact electrode 14.Description is made referring to FIG. 3; where, portions designated bythe same numerals as in FIG. 1 represent that they perform the samefunctions respectively. In the following, only the points of differencefrom embodiment 1 are described. In embodiment 1, the is disposedimmediately next to the internal contact electrodes 14, as viewed fromabove the package 13. However, in the present embodiment 3, the region18 a, 18 b is not disposed at a place where it has an immediate contactwith the internal contact electrodes 14.

Therefore, when a pattern recognizing procedure is conducted on thepackage 13 from the above, a cross point formed by the extension of aside of the non-electrode portion 18 a, 18 b, which side facing thestepped level-difference 26, and the extension of a side of the internalcontact electrode 14, which side facing the inner bottom surface ofpackage 13, is detected, and then the middle point is established in astraight line connecting the corresponding two cross points. Using themiddle point as reference, and based on various dimensional particularsof the package 13, a spot for bonding the interconnection wire 19 on theinternal contact electrode 14 is determined.

And then, the interconnection wire 19 at one end is bonded on theinternal contact electrode 14, while the other end on the contactelectrode 24 of SAW chip 17 for electrical connection.

A lid 21 is welded on the seam ring 20 provided around the upper surfaceof package 13 to have the SAW chip 17 sealed in the package 13.

Now in the following, points of significance with the present embodiment3 are described.

(1) In the present embodiment, a pattern recognition procedure isapplied on the package 13 from the above to detect a boundary pointbetween the inner bottom surface of package 13 and the internal contactelectrode 14, for determining a place for mounting the SAW chip 17 or aspot for bonding the interconnection wire 19 on the internal contactelectrode 14. The reason for the above is as follows:

In order to reduce the possible recognition errors to a minimum, it ispreferred to make a distance between recognition points as long aspossible. In this point of view, a boundary point between the seam ring20 and the first ceramic frame body 11, as viewed from above the package13, may be detected. However, since the seam ring 20 is fixed on theupper surface of the second ceramic frame body 12 by means of silverbrazing 25 the placement accuracy can easily be displaced. On the otherhand, the amount of displacement is smaller with the first ceramic framebody 11, which is shaped through a punching process, as compared withthat of seam ring 20.

Furthermore, besides the case where a package 13 is sealed by welding alid 21 using the seam ring 20, the upper end-surface of the secondceramic frame body 12 needs to be provided with a plated layer even whenit is sealed with solder. In this case, the accuracy in the shape isinferior to that of the first ceramic frame body 11. Therefore, it ispreferred to use a boundary formed by the first ceramic frame body 11and the inner bottom surface of package 13.

(2) Since the internal contact electrode 14 and the shield electrode 15have been formed with the same gold plating, it is difficult for thepattern recognition conducted from above the package 13 to distinguishone from the other. When a non-electrode portion 18 a, 18 b is providednext to the internal contact electrode 14, the location aligning can bemade at a higher accuracy level by taking advantage of a contrastgenerated by difference in the color between the two.

The non-electrode 18 a, 18 b may be provided instead in other layoutarrangement, where corners of the region 18 a, 18 b and the internalcontact electrode 14 are adjacent, as viewed from above the package 13like in FIG. 1.

Embodiment 4

Embodiment 4 is described also referring to FIG. 3; where, portionsdesignated by the same numerals as in FIG. 1 represent that they performrespectively the same functions as those described in embodiments 1 and2. So, description of such portions are eliminated.

In the following, only the points of difference as compared withembodiments 1 and 2 are described. In embodiment 4, the non-electrodeportion 18 a, 18 b is not disposed at a place where it has an immediatecontact with the internal contact electrodes 14; like the layout ofembodiment 3. However, one of the sides of the region 18 a, 18 b and oneof the sides of the internal contact electrode 14 coincide on theboundary line formed by the stepped level-difference 26 and the innerbottom surface.

Therefore, a pattern recognition procedure is applied from above thepackage 13 for detecting, in each of the stepped level-differences 26opposing to each other, a point at which the extension of one of thesides of the non-electrode portion 18 a, 18 b and the extension of theinternal contact electrode 14's other side cross at a right angle. In astraight line connecting the two corresponding cross points, the middlepoint is established to be used as reference. Using the middle point,and based on various dimensional particulars of the package 13, a placefor mounting the SAW chip 17 is determined.

Embodiment 5

A point of significance with embodiment 5 is in the shape of a firstceramic frame body 11. The present embodiment 5 is described referringto FIG. 4; where, portions designated by the same numerals as in FIG. 1represent that they perform respectively the same functions as thosedescribed in embodiment 1. So, detailed description of such portions areeliminated.

In the following, only the points of difference as compared withembodiment 1 are described. In the first ceramic frame body 11 inembodiment 1, the inner side wall and the upper surface cross to form aright angle; whereas, it is an acute angle in the present embodiment 5.Thereby, clearance between the opposing stepped level-differences 26becomes greater in the lower part than in the upper part.

The first ceramic frame body 11 in embodiment 5 may be provided by firstpunching a ceramic sheet to a certain predetermined shape and thenproviding the inner side wall with a tapered form, for example. When theinner side wall and the upper surface of the ceramic frame body 11 forman acute angle, a rectangular cross point formed by one of the sides ofthe non-electrode portion 18 a, 18 b, or the extension, and one of thesides of the internal contact electrode 14, or the extension, can bedetected at a higher accuracy level during a pattern recognitionprocedure conducted from above the package 13.

The same applies also to the SAW chip 17 in the earlier embodiments 2through 4.

Now the points of significance in embodiments 1 through 5 are briefed asfollows:

(1) In embodiments 1 and 3, it is recited that, as viewed from above thepackage 13, a rectangular cross point formed by one of the sides of thenon-electrode portion 18 a, 18 b, or the extension, and one of the sidesof the internal contact electrode 14, or the extension, is detected at apattern recognition, and the contact electrode 24 of SAW chip 17 and theinternal contact electrode 14 are reliably connected by means ofinterconnection wire 19.

In embodiments 2 and 4, it is recited that, prior to mounting a SAW chip17 in the package 13, a rectangular cross point formed by one of thesides of the non-electrode portion 18 a, 18 b, or the extension, and oneof the sides of the internal contact electrode 14, or the extension, isdetected at a pattern recognition as viewed from above the package 13,for determining a place for mounting the SAW chip 17.

Thus, a place for mounting the SAW chip 17 and a spot for bonding theinterconnection wire 19 on the internal contact electrode 14 can bespecifically determined when the non-electrode portion 18 a, 18 b andthe internal contact electrode 14 are disposed in an arrangement where,as viewed from above the package 13, one of the sides, or theextensions, of the above two forms cross at substantially a right angle.In manufacturing one SAW device, the pattern recognition may of coursebe conducted for twice; namely, for determining a place for mounting aSAW chip 17 and a point for bonding the interconnection wire 19 on theinternal contact electrode 14.

(2) In embodiments 1 and 3, where the pattern recognition is conductedfor determining a spot for bonding the interconnection wire 19 on theinternal contact electrode 14, a non-electrode portion 18 a, 18 b whosewidth is broader than that of the focus shift margin of a lens used forthe pattern recognition contributes to avoid possible recognitionerrors.

(3) In a configuration where the upper surfaces of SAW chip 17 and theinternal contact electrode 14 are on substantially the same plane, bothof the SAW chip 17 and the internal contact electrode 14 can becontained in a focused scope at the pattern recognition. Thus, therectangular cross point formed by one of the sides of the non-electrodeportion 18 a, 18 b, or the extension, and one of the sides of theinternal contact electrode 14, or the extension, and electrode patternson the SAW chip 17, such as contact electrodes, comb-formed electrodes,can be recognized at once.

(4) Furthermore, in embodiments 1 and 2, where a cross point formed byone of the sides of the non-electrode portion 18 a, 18 b and one of thesides of the internal contact electrode 14 is detected, a boundarybetween the package 13 and the inner bottom surface can be surelyrecognized. On the other hand, what is detected in embodiments 3 and 4is a rectangular cross point formed by the extension of one of the sidesof the non-electrode portion 18 a, 18 b and the extension of one of thesides of the internal contact electrode 14. Therefore, if there is adisplacement taken place with the package 13, for example, the locationrecognition accuracy in embodiments 3 and 4 may become slightly inferiorto that in embodiments 1 and 2.

Therefore, it is preferred to dispose the non-electrode portion 18 a, 18b to be adjacent, as viewed from above the package 13, to the internalcontact electrode 14, like in embodiments 1 and 2. In order to avoid apossible consequence that may result from a slightly displaced formationof the region 18 a, 18 b, it is preferred to form the region 18 a, 18 bso that the length of a side facing the internal contact electrode 14 isgreater than the value of a clearance between the internal contactelectrodes 14 formed on the same stepped level-difference 26.

(5) The point of significance with embodiment 5 is in the shape of afirst ceramic frame body 11. Namely, the inner side-wall and the uppersurface of the first ceramic frame body 11 form an acute angle. Thereby,distance between the opposing stepped level-differences 26 becomesgreater in the lower section than in the upper section. With thisconfiguration, a rectangular cross point formed by one of the sides ofthe non-electrode portion 18 a, 18 b, or the extension, and one of thesides of the internal contact electrode 14, or the extension, candetected at a high accuracy level in a pattern recognition conductedfrom above the package 13. The above-described configuration with theceramic frame body 11 may be introduced in all the embodiments 1 through4.

(6) The non-electrode portion 18 a, 18 b has been provided, in theabove-described embodiments, facing each of the opposing steppedlevel-differences 26. Instead, the above two regions 18 a, 18 b may beprovided altogether in a side facing one of the stepped leveldifferences 26 for detecting a rectangular cross point formed by one ofthe sides of the non-electrode portion 18 a, 18 b, or the extension, andone of the sides of the internal contact electrode 14, or the extension,for the purpose of location aligning. In order to recognize the point ata higher accuracy level, it is preferred to provide the non-electrodeportion 18 a, 18 b at both sides of a SAW chip 17 disposed on the bottomof the package 13.

(7) A boundary, as viewed from above the package 13, between the steppedlevel-difference 26 and the bottom surface can be recognized inaccordance with the present invention at a high accuracy level fordetermining a location of mounting a SAW chip 17. As a result, theinside dimensions of the package 13 can be reduced to a minimum requiredfor mounting a SAW chip 17 therein. Thus the present invention offers acompact SAW device.

Among the devices of the present invention, a shield electrode 15 ofgreater area provides the greater shielding effects. Further, thenon-electrode portion 18 a, 18 b may be provided for three or more;however, two such regions are sufficient for determining a place formounting the SAW chip 17.

Although the above exemplary embodiments have been described using a SAWdevice as an example, the present invention offers the same advantagealso to such other electronic component containing a chip within thepackage which is provided with electrodes on the upper surface and thebottom surface.

INDUSTRIAL APPLICABILITY

In accordance with the present invention, such electronic components canbe made available in which a spot for bonding the interconnection wireon the internal contact electrode is determined at a high accuracylevel. A method for manufacturing the electronic components is alsocontained in the present invention.

1. An electronic component configured for mounting a chip comprising: apackage having an inner wall formed circumferentially around the packagewith a stepped level-difference in the inner wall, the steppedlevel-difference including upper and lower portions; a plurality ofinternal contact electrodes provided on an upper end-surface of saidstepped level-difference in the inner wall; a shield electrode providedon an inner bottom surface of said package at a side facing said steppedlevel-difference; a non-electrode portion defined to be adjacent to theshield electrode where the shield electrode is not formed and thenon-electrode portion being provided on a part of the inner bottomsurface of said package; and an interconnection wire for connecting saidchip and a respective internal contact electrode of the plurality ofinternal contact electrodes; wherein the lower portion of the steppedlevel-difference and the inner bottom surface form a cavity with anaperture such that a clearance between opposing sides of the lowerportion of the stepped level-difference is greater at the inner bottomsurface than at the aperture of the cavity.
 2. An electronic componentcomprising: a ceramic substrate; a first ceramic frame body formed onone of the surfaces of said ceramic substrate; a second ceramic framebody formed on said first ceramic frame body; steps formed by saidceramic substrate and said first ceramic frame body and by said firstceramic frame body and said second ceramic frame body; an internalcontact electrode formed on a main surface of said first ceramic framebody at the same side as a junction formed by said first ceramic framebody and said second ceramic frame body; and a chip mounted on the onesurface of said ceramic substrate; wherein: a shield electrode isprovided on the one surface of said ceramic substrate to define aboundary, a non-electrode portion is defined to be adjacent to theshield electrode where the shield electrode is not formed and thenon-electrode portion is provided on a part of the inner bottom surfaceof said package; and an inner side of the first ceramic frame body andthe main surface of said first ceramic frame body cross to form an acuteangle such that the first ceramic frame body is tapered to providegreater clearance between the chip and the inner side of the firstceramic frame body nearer to the ceramic substrate than further from theceramic substrate.
 3. The electronic component of claim 1, wherein oneside of said non-electrode portion and one side of said internal contactelectrode substantially coincide on a straight line.
 4. The electroniccomponent of claim 2, wherein one side of said internal contactelectrode and one side of said non-electrode portion cross atsubstantially a right angle, as viewed from above said electroniccomponent.
 5. The electronic component of claim 1, wherein one side ofone of said internal contact electrodes and one side of saidnon-electrode portion cross at substantially a right angle, as viewedfrom above said electronic component.
 6. The electronic component ofclaim 1, wherein a part of said non-electrode portion is in contact witha part of said stepped level-difference.
 7. The electronic component ofclaim 1, wherein the non-electrode portion and the plurality of internalcontact electrodes have different optical characteristics such that theplurality of internal contact electrodes and the non-electrode portiondefine a visible boundary, as viewed from above said electroniccomponent, for placement of the chip.